Epoxy resin encapsulant is a very good packaging material, often used in LED, automotive electronics, including circuit boards, to protect components from damage, excellent confidentiality. Xinwei company specializes in the production of epoxy resin encapsulant. Its products have good fluidity and can easily penetrate into the gaps of the product; it can be cured at room temperature or medium temperature, the curing speed is moderate, and the moisture, water, oil, and dust resistance is good. Compared with other types of potting glue, the sealing glue has the following advantages:
1: There are many varieties of epoxy resins, curing agents and modifiers, which can be designed through reasonable and ingenious formulas to make the adhesives have the required manufacturability (such as fast curing, room temperature curing, low temperature curing, water curing, low viscosity, High viscosity, etc.), and has the required performance (such as high temperature resistance, low temperature resistance, high strength, high flexibility, aging resistance, electrical conductivity, magnetic permeability, thermal conductivity, etc.).
2: Epoxy resin contains a variety of polar groups and highly active epoxy groups, so it has a strong compatibility with metals, glass, cement, wood, plastics and other polar materials, especially materials with high surface activity. The adhesive strength and the cohesive strength of the epoxy cured product are also very large, so its bonding strength is very high.
3: The cured product has good acid and alkali resistance, moisture-proof, water-proof, oil-proof and dust-proof performance, resistance to damp heat and atmospheric aging; it has good electrical and physical characteristics such as insulation, compression, high bonding strength
4: There is basically no low molecular volatiles when the epoxy resin is cured. The volume shrinkage rate of the adhesive layer is small, about 1% to 2%, which is one of the varieties with the smallest curing shrinkage rate among thermosetting resins. After adding filler, it can be reduced to below 0.2%. The linear expansion coefficient of the epoxy cured product is also very small. Therefore, the internal stress is small and has little effect on the bonding strength. In addition, the creep of the epoxy cured product is small, so the dimensional stability of the adhesive layer is good.
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